Supplier: ficonTEC GmbH

One archived procurement

Recent procurements where the supplier ficonTEC GmbH is mentioned

2016-09-21   Supply of a Flipchip packaging and assembly equipment (University College Cork (UCC))
The Photonic Packaging Group at the Tyndall National Institute, University College Cork is seeking to purchase a High Accuracy Photonic Flipchip Packaging and Assembly piece of equipment. The purpose of the equipment is to support the development and fabrication of fully assembled photonic prototypes. View the procurement ยป
Mentioned suppliers: ficonTEC GmbH