Supply of a Flipchip packaging and assembly equipment

University College Cork (UCC)

The Photonic Packaging Group at the Tyndall National Institute, University College Cork is
seeking to purchase a High Accuracy Photonic Flipchip Packaging and Assembly
piece of equipment. The purpose of the equipment is to support the development
and fabrication of fully assembled photonic prototypes.

Deadline

The time limit for receipt of tenders was 2016-10-21. The procurement was published on 2016-09-21.

Suppliers

The following suppliers are mentioned in award decisions or other procurement documents:

Who? What? Where?
Procurement history
Date Document
2016-09-21 Contract notice
2017-07-10 Contract award notice
Contract notice (2016-09-21)
Object
Scope of the procurement
Title: Miscellaneous equipment
Reference number: UCC/2016/46
Short description:
The Photonic Packaging Group at the Tyndall National Institute, University College Cork is seeking to purchase a High Accuracy Photonic Flipchip Packaging and Assembly piece of equipment. The purpose of the equipment is to support the development and fabrication of fully assembled photonic prototypes.
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Notice metadata
Original language: English 🗣️
Document type: Contract notice
Nature of contract: Supplies
Regulation: European Union, with participation of GPA countries
Common procurement vocabulary (CPV)
Code: Miscellaneous equipment 📦
Additional CPV: Packaging machines 📦
Place of performance
NUTS region: South-West 🏙️

Procedure
Procedure type: Open procedure
Type of bid: Submission for all lots
Award criteria
The most economic tender

Contracting authority
Identity
Country: Ireland 🇮🇪
Awarding authority type: Body governed by public law
Awarding authority name: University College Cork (UCC)
Postal address: 6 Elderwood, College Rd
Postal town: Cork
Contact
Internet address: http://www.ucc.ie 🌏
E-mail: procurement@ucc.ie 📧
Phone: +353 214903514 📞
URL for documents: http://irl.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=103272&B=ETENDERS_SIMPLE 🌏
URL for participation: http://irl.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=103272&B=ETENDERS_SIMPLE 🌏

Reference
Dates
Date dispatched: 2016-09-21 📅
Submission deadline: 2016-10-21 📅
Publication date: 2016-09-23 📅
Start date: 2016-12-01 📅
Identifiers
Notice number: 2016/S 184-329610
OJ-S issue: 184

Object
Scope of the procurement
Short description:
The Photonic Packaging Group at the Tyndall National Institute, University College Cork is
seeking to purchase a High Accuracy Photonic Flipchip Packaging and Assembly
piece of equipment. The purpose of the equipment is to support the development
and fabrication of fully assembled photonic prototypes.
Estimated total value: 600 000 EUR 💰
Short description:
The Photonic Packaging Group at the Tyndall Institute, University College Cork is
Estimated value excluding VAT: 600 000 EUR 💰
Description of options: Additional warranty.
Name of EU-financed project or programme: It may be co-funded through ERDF funding.

Legal, economic, financial and technical information
Conditions for participation
Suitability to pursue the professional activity: Refer to RFT.
Contract execution
Contract performance conditions: Refer to RFT.

Procedure
Time of receipt of tenders: 12:00
Languages in which tenders or requests to participate may be submitted: English 🗣️
Tender validity period: 3 months
Tender opening date: 2016-10-21 📅
Tender opening time: 12:00
Place: Etenders.

Contracting authority
Identity
National registration number: N/a
Contact
Contact point: Procurement & Contracts Office (UCC)
Address of the buyer profile: https://irl.eu-supply.com/ctm/Company/CompanyInformation/Index/1198 🌏
Documents URL: http://irl.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=103272&B=ETENDERS_SIMPLE 🌏

Complementary information
Review body
Name: Irish High Court
Postal town: Dublin
Country: Ireland 🇮🇪
Source: OJS 2016/S 184-329610 (2016-09-21)
Contract award notice (2017-07-10)
Object
Scope of the procurement
Short description:
The Photonic Packaging Group at the Tyndall National Institute, University College Cork is seeking to purchase a High Accuracy Photonic Flipchip Packaging and Assembly piece of equipment. The purpose of the equipment is to support the development and fabrication of fully assembled photonic prototypes.
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Total value of the procurement: 542 000 EUR 💰
Notice metadata
Document type: Contract award notice

Procedure
Type of bid: Not applicable

Contracting authority
Identity
Awarding authority name: University College Cork ( UCC )

Reference
Dates
Date dispatched: 2017-07-10 📅
Publication date: 2017-07-13 📅
Identifiers
Notice number: 2017/S 132-269789
Refers to notice: 2016/S 184-329610
OJ-S issue: 132

Object
Scope of the procurement
Short description:
The Photonic Packaging Group at the Tyndall Institute, University College Cork is seeking to purchase a High Accuracy Photonic Flipchip Packaging and Assembly piece of equipment. The purpose of the equipment is to support the development and fabrication of fully assembled photonic prototypes.
Show more

Procedure
Award criteria
Quality criterion (name): Technical Merit of Offering
Quality criterion (weighting): 35
Quality criterion (name): Technical Support and Maintenance
Quality criterion (weighting): 20
Quality criterion (name): Delivery
Quality criterion (weighting): 5
Cost criterion: Cost of Ownership
Cost weighting: 40

Award of contract
Date of contract conclusion: 2017-03-01 📅

Contracting authority
Contact
Contact point: Procurement and Contracts Office (UCC)
Source: OJS 2017/S 132-269789 (2017-07-10)