Supply of a Flipchip packaging and assembly equipment
The Photonic Packaging Group at the Tyndall National Institute, University College Cork is
seeking to purchase a High Accuracy Photonic Flipchip Packaging and Assembly
piece of equipment. The purpose of the equipment is to support the development
and fabrication of fully assembled photonic prototypes.
Deadline
The time limit for receipt of tenders was 2016-10-21.
The procurement was published on 2016-09-21.
Suppliers
The following suppliers are mentioned in award decisions or other procurement documents:
Who?
What?
Procurement history
| Date |
Document |
| 2016-09-21
|
Contract notice
|
| 2017-07-10
|
Contract award notice
|