Tenders are sought for the supply and delivery of High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC. Miniaturisation and integration are key themes across all areas of Tyndall’s research. Development of next generation technologies requires ever decreasing device sizes coupled with ever-increasing functionality. The task of miniaturisation beings with device design and fabrication where sub-micron technologies are now industry standard, and the development of nanoscale processes is progressing rapidly. The challenges of miniaturisation extend onwards to the back-end processes where the removal of unused bulk semiconductor material through precision lapping and polishing is essential to minimising the size of a final device. Tyndall now wishes to enhance its back-end processing capability through the procurement of a high-precision wafer lapping and polishing system for use with silicon, III-V and other semiconductor materials.
Deadline
The time limit for receipt of tenders was 2024-06-25.
The procurement was published on 2024-05-22.
Contract notice (2024-05-22) Object Scope of the procurement
Title: Supply, Delivery and Commissioning of a High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC
Short description:
“Tenders are sought for the supply and delivery of High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC. Miniaturisation and...”
Short description
Tenders are sought for the supply and delivery of High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC. Miniaturisation and integration are key themes across all areas of Tyndall’s research. Development of next generation technologies requires ever decreasing device sizes coupled with ever-increasing functionality. The task of miniaturisation beings with device design and fabrication where sub-micron technologies are now industry standard, and the development of nanoscale processes is progressing rapidly. The challenges of miniaturisation extend onwards to the back-end processes where the removal of unused bulk semiconductor material through precision lapping and polishing is essential to minimising the size of a final device. Tyndall now wishes to enhance its back-end processing capability through the procurement of a high-precision wafer lapping and polishing system for use with silicon, III-V and other semiconductor materials.
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Type of contract: Supplies
Products/services: Laboratory, optical and precision equipments (excl. glasses)📦
Estimated value excluding VAT: 81 000 EUR 💰
Information about lots
Tenders may be submitted for maximum number of lots: 0
Description
Description of the procurement:
“Tenders are sought for the supply and delivery of High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC. Miniaturisation and...”
Description of the procurement
Tenders are sought for the supply and delivery of High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC. Miniaturisation and integration are key themes across all areas of Tyndall’s research. Development of next generation technologies requires ever decreasing device sizes coupled with ever-increasing functionality. The task of miniaturisation beings with device design and fabrication where sub-micron technologies are now industry standard, and the development of nanoscale processes is progressing rapidly. The challenges of miniaturisation extend onwards to the back-end processes where the removal of unused bulk semiconductor material through precision lapping and polishing is essential to minimising the size of a final device. Tyndall now wishes to enhance its back-end processing capability through the procurement of a high-precision wafer lapping and polishing system for use with silicon, III-V and other semiconductor materials.
Procedure Type of procedure
Open procedure ✅ Administrative information
Time limit for receipt of tenders or requests to participate: 2024-06-25 14:00:00 📅
Conditions for opening of tenders: 2024-06-25 14:30:00 📅
Conditions for opening of tenders (place): https://www.etenders.gov.ie/epps/cft/prepareViewCfTWS.do?resourceId=3644242
Languages in which tenders or requests to participate may be submitted: English 🗣️
Complementary information Review body
Name: The High Court of Ireland
National registration number: The High Court of Ireland
Postal address: Four Courts, Inns Quay, Dublin 7
Postal code: D07 WDX8
Postal town: Dublin
Country: Ireland 🇮🇪
E-mail: highcourtcentraloffice@courts.ie📧
Phone: +353 1 8886000📞 Information about electronic workflows
Electronic invoicing will be accepted
Electronic ordering will be used
Electronic payment will be used
Source: OJS 2024/S 100-307081 (2024-05-22)