UCC — High Performance Focused Ion Beam Milling Capability

Education Procurement Service (EPS)

The Specialty Products and Services Centre (SP&S) at Tyndall National Institute, UCC, carry out analysis on a wide variety of semiconductor devices, ranging from traditional silicon microelectronics and Silicon MEMS to III-V photonic devices. We wish to extend our capability in the area of focused ion beam (which can encompass Gallium beam/plasma/laser milling or a combination thereof) by purchasing a fully functional load locked system including pumps which will allow us to move our processing to a higher TRL level in terms of substrate size, milling speed and quality of lamella preparation. As much of the work is in the area of semiconductor R&D we have a requirement for a system that can handle substrates of varying sizes from 0.3 x 0.3 mm and various irregular shaped pieces through to full wafers which could include wafers ranging in size from 50 mm, 100 mm, 150 mm and 200 mm wafers.

Deadline

The time limit for receipt of tenders was 2020-10-08. The procurement was published on 2020-09-08.

Suppliers

The following suppliers are mentioned in award decisions or other procurement documents:

Who? What? Where?
Procurement history
Date Document
2020-09-08 Contract notice
2021-07-07 Contract award notice
Contract notice (2020-09-08)
Object
Scope of the procurement
Title: Laboratory, optical and precision equipments (excl. glasses)
Reference number: LEE945C
Short description:
The Specialty Products and Services Centre (SP&S) at Tyndall National Institute, UCC, carry out analysis on a wide variety of semiconductor devices, ranging from traditional silicon microelectronics and Silicon MEMS to III-V photonic devices. We wish to extend our capability in the area of focused ion beam (which can encompass Gallium beam/plasma/laser milling or a combination thereof) by purchasing a fully functional load locked system including pumps which will allow us to move our processing to a higher TRL level in terms of substrate size, milling speed and quality of lamella preparation. As much of the work is in the area of semiconductor R&D we have a requirement for a system that can handle substrates of varying sizes from 0.3 x 0.3 mm and various irregular shaped pieces through to full wafers which could include wafers ranging in size from 50 mm, 100 mm, 150 mm and 200 mm wafers.
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Notice metadata
Original language: English 🗣️
Document type: Contract notice
Nature of contract: Supplies
Regulation: European Union
Common procurement vocabulary (CPV)
Code: Laboratory, optical and precision equipments (excl. glasses) 📦
Additional CPV: Laboratory reagents 📦
Place of performance
NUTS region: Éire/Ireland 🏙️

Procedure
Procedure type: Open procedure
Type of bid: Submission for all lots
Award criteria
The most economic tender

Contracting authority
Identity
Country: Ireland 🇮🇪
Awarding authority type: Body governed by public law
Awarding authority name: Education Procurement Service (EPS)
Postal address: University of Limerick, Co. Limerick
Postal town: Castletroy
Contact
Internet address: http://www.educationprocurementservice.ie 🌏
E-mail: eimear.brennan@ul.ie 📧
Phone: +353 61234901 📞
URL for documents: http://irl.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=173596&B=ETENDERS_SIMPLE 🌏
URL for participation: http://irl.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=173596&B=ETENDERS_SIMPLE 🌏

Reference
Dates
Date dispatched: 2020-09-08 📅
Submission deadline: 2020-10-08 📅
Publication date: 2020-09-11 📅
Identifiers
Notice number: 2020/S 177-425298
OJ-S issue: 177

Object
Scope of the procurement
Estimated total value: 3 700 000 EUR 💰
Short description:
The Specialty Products and Services Centre (SP&S) at Tyndall National Institute, UCC, carry out analysis on a wide variety of semiconductor devices, ranging from traditional Silicon microelectronics and Silicon MEMS to III-V photonic devices. We wish to extend our capability in the area of focused ion beam (which can encompass Gallium beam/plasma/laser milling or a combination thereof) by purchasing a fully functional load locked system including pumps which will allow us to move our processing to a higher TRL level in terms of substrate size, milling speed and quality of lamella preparation. As much of the work is in the area of semiconductor R&D we have a requirement for a system that can handle substrates of varying sizes from 0.3 x 0.3 mm and various irregular shaped pieces through to full wafers which could include wafers ranging in size from 50 mm, 100 mm, 150 mm and 200 mm wafers. The tender response must clearly show the costs for all items and any additional options must be clearly identified as such and costed separately.
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Estimated value excluding VAT: 3 700 000 EUR 💰
Duration: 12 months
Description of renewals:
The contracting authority reserves the right to extend the term for a period or periods of up to [1 Year] with a maximum of [2] such extension or extensions on the same terms and conditions, subject to the contracting authority’s obligations at law.

Legal, economic, financial and technical information
Conditions for participation
Suitability to pursue the professional activity: Please see RFT document for further details.
Economic and financial standing: Please see RFT document for further details.
Minimum level(s) of standards: Please see RFT document for further details.
Technical and professional ability: Please see RFT document for further details.
Contract execution
Contract performance conditions: Please see RFT document for further details.

Procedure
Legal basis: 32014L0024
Time of receipt of tenders: 14:00
Languages in which tenders or requests to participate may be submitted: English 🗣️
Tender opening date: 2020-10-08 📅
Tender opening time: 14:00

Contracting authority
Identity
National registration number: IE 6609370 G
Contact
Contact point: Eimear Brennan
Address of the buyer profile: https://irl.eu-supply.com/ctm/Company/CompanyInformation/Index/87073 🌏
Documents URL: http://irl.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=173596&B=ETENDERS_SIMPLE 🌏

Complementary information
Review body
Name: Office of the High Court
Postal address: Four Courts Ground Floor, Inns Quay
Postal town: Dublin 7
Country: Ireland 🇮🇪
Phone: +353 18886000 📞
E-mail: highcourtcentraloffice@courts.ie 📧
Source: OJS 2020/S 177-425298 (2020-09-08)
Contract award notice (2021-07-07)
Object
Scope of the procurement
Short description:
The Specialty Products and Services Centre (SP&S) at Tyndall National Institute, UCC, carry out analysis on a wide variety of Semiconductor devices, ranging from traditional Silicon microelectronics and Silicon MEMS to III-V photonic devices. We wish to extend our capability in the area of focussed ion beam (which can encompass Gallium beam/plasma/laser milling or a combination thereof) by purchasing a fully functional load locked system including pumps which will allow us to move our processing to a higher TRL level in terms of substrate size, milling speed and quality of lamella preparation. As much of the work is in the area of Semiconductor R&D we have a requirement for a system that can handle substrates of varying sizes from 0.3x0.3 mm and various irregular shaped pieces through to full wafers which could include wafers ranging in size from 50mm, 100mm, 150mm and 200 mm wafers.
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Notice metadata
Document type: Contract award notice

Procedure
Type of bid: Not applicable

Contracting authority
Identity
Postal address: University of Limerick
Postal code: Co. Limerick

Reference
Dates
Date dispatched: 2021-07-07 📅
Publication date: 2021-07-12 📅
Identifiers
Notice number: 2021/S 132-350489
Refers to notice: 2020/S 177-425298
OJ-S issue: 132

Object
Scope of the procurement
Short description:
The Specialty Products and Services Centre (SP&S) at Tyndall National Institute, UCC, carry out analysis on a wide variety of Semiconductor devices, ranging from traditional Silicon microelectronics and Silicon MEMS to III-V photonic devices. We wish to extend our capability in the area of focussed ion beam (which can encompass Gallium beam/plasma/laser milling or a combination thereof) by purchasing a fully functional load locked system including pumps which will allow us to move our processing to a higher TRL level in terms of substrate size, milling speed and quality of lamella preparation. As much of the work is in the area of Semiconductor R&D we have a requirement for a system that can handle substrates of varying sizes from 0.3x0.3 mm and various irregular shaped pieces through to full wafers which could include wafers ranging in size from 50mm, 100mm, 150mm and 200mm wafers. The tender response must clearly show the costs for all items and any additional options must be clearly identified as such and costed separately.
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Procedure
Award criteria
Quality criterion (name): Technical merit of offering
Quality criterion (weighting): 40 %
Quality criterion (name): Strategic agreements
Quality criterion (weighting): 10 %
Quality criterion (name): Technical support and maintenance installation and commissioning
Quality criterion (weighting): 15 %
Price (weighting): 35 %

Award of contract
Date of contract conclusion: 2021-04-30 📅
Name: TESCAN-UK Ltd
National registration number: 177010526
Postal address: Unit 2, Wellbrook Court Girton
Postal town: Cambridge
Postal code: CB3 0NA
Country: United Kingdom 🇬🇧
E-mail: info-uk@tescan.com 📧
Internet address: http://tescan.com 🌏
Information about tenders
Number of tenders received: 4

Complementary information
Review body
Postal town: Dublin
Postal code: 7
Source: OJS 2021/S 132-350489 (2021-07-07)
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