The Specialty Products and Services Centre (SP&S) at Tyndall National Institute, UCC, carry out analysis on a wide variety of semiconductor devices, ranging from traditional silicon microelectronics and Silicon MEMS to III-V photonic devices. We wish to extend our capability in the area of focused ion beam (which can encompass Gallium beam/plasma/laser milling or a combination thereof) by purchasing a fully functional load locked system including pumps which will allow us to move our processing to a higher TRL level in terms of substrate size, milling speed and quality of lamella preparation. As much of the work is in the area of semiconductor R&D we have a requirement for a system that can handle substrates of varying sizes from 0.3 x 0.3 mm and various irregular shaped pieces through to full wafers which could include wafers ranging in size from 50 mm, 100 mm, 150 mm and 200 mm wafers.
Deadline
The time limit for receipt of tenders was 2020-10-08.
The procurement was published on 2020-09-08.
Suppliers
The following suppliers are mentioned in award decisions or other procurement documents:
Object Scope of the procurement
Title: UCC — High Performance Focused Ion Beam Milling Capability
LEE945C
Products/services: Laboratory, optical and precision equipments (excl. glasses)📦
Short description:
“The Specialty Products and Services Centre (SP&S) at Tyndall National Institute, UCC, carry out analysis on a wide variety of semiconductor devices, ranging...”
Short description
The Specialty Products and Services Centre (SP&S) at Tyndall National Institute, UCC, carry out analysis on a wide variety of semiconductor devices, ranging from traditional silicon microelectronics and Silicon MEMS to III-V photonic devices. We wish to extend our capability in the area of focused ion beam (which can encompass Gallium beam/plasma/laser milling or a combination thereof) by purchasing a fully functional load locked system including pumps which will allow us to move our processing to a higher TRL level in terms of substrate size, milling speed and quality of lamella preparation. As much of the work is in the area of semiconductor R&D we have a requirement for a system that can handle substrates of varying sizes from 0.3 x 0.3 mm and various irregular shaped pieces through to full wafers which could include wafers ranging in size from 50 mm, 100 mm, 150 mm and 200 mm wafers.
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Estimated value excluding VAT: EUR 3 700 000 💰
The Specialty Products and Services Centre (SP&S) at Tyndall National Institute, UCC, carry out analysis on a wide variety of semiconductor devices, ranging from traditional Silicon microelectronics and Silicon MEMS to III-V photonic devices. We wish to extend our capability in the area of focused ion beam (which can encompass Gallium beam/plasma/laser milling or a combination thereof) by purchasing a fully functional load locked system including pumps which will allow us to move our processing to a higher TRL level in terms of substrate size, milling speed and quality of lamella preparation. As much of the work is in the area of semiconductor R&D we have a requirement for a system that can handle substrates of varying sizes from 0.3 x 0.3 mm and various irregular shaped pieces through to full wafers which could include wafers ranging in size from 50 mm, 100 mm, 150 mm and 200 mm wafers. The tender response must clearly show the costs for all items and any additional options must be clearly identified as such and costed separately.
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Price is not the only award criterion and all criteria are stated only in the procurement documents
Scope of the procurement
Estimated total value excluding VAT: EUR 3 700 000 💰
Duration of the contract, framework agreement or dynamic purchasing system
The time frame below is expressed in number of months.
Description
Duration: 12
Duration of the contract, framework agreement or dynamic purchasing system
This contract is subject to renewal ✅ Description
Description of renewals:
“The contracting authority reserves the right to extend the term for a period or periods of up to [1 Year] with a maximum of [2] such extension or extensions...”
Description of renewals
The contracting authority reserves the right to extend the term for a period or periods of up to [1 Year] with a maximum of [2] such extension or extensions on the same terms and conditions, subject to the contracting authority’s obligations at law.
Legal, economic, financial and technical information Conditions for participation
List and brief description of conditions: Please see RFT document for further details.
Economic and financial standing
List and brief description of selection criteria: Please see RFT document for further details.
Conditions for participation
Please see RFT document for further details.
Technical and professional ability
List and brief description of selection criteria: Please see RFT document for further details.
Conditions for participation
Conditions for participation (technical and professional ability): Please see RFT document for further details.
Conditions related to the contract
Contract performance conditions: Please see RFT document for further details.
Procedure Type of procedure
Open procedure
Administrative information
Time limit for receipt of tenders or requests to participate: 2020-10-08
14:00 📅
Languages in which tenders or requests to participate may be submitted: English 🗣️
Conditions for opening of tenders: 2020-10-08
14:00 📅
Complementary information Review body
Name: Office of the High Court
Postal address: Four Courts Ground Floor, Inns Quay
Postal town: Dublin 7
Country: Ireland 🇮🇪
Phone: +353 18886000📞
E-mail: highcourtcentraloffice@courts.ie📧
Source: OJS 2020/S 177-425298 (2020-09-08)
Contract award notice (2021-07-07) Contracting authority Name and addresses
Postal address: University of Limerick
Postal code: Co. Limerick
Information about joint procurement
The contract is awarded by a central purchasing body
Object Scope of the procurement
Title: UCC — High Performance Focussed Ion Beam Milling Capability
LEE945C
Short description:
“The Specialty Products and Services Centre (SP&S) at Tyndall National Institute, UCC, carry out analysis on a wide variety of Semiconductor devices, ranging...”
Short description
The Specialty Products and Services Centre (SP&S) at Tyndall National Institute, UCC, carry out analysis on a wide variety of Semiconductor devices, ranging from traditional Silicon microelectronics and Silicon MEMS to III-V photonic devices. We wish to extend our capability in the area of focussed ion beam (which can encompass Gallium beam/plasma/laser milling or a combination thereof) by purchasing a fully functional load locked system including pumps which will allow us to move our processing to a higher TRL level in terms of substrate size, milling speed and quality of lamella preparation. As much of the work is in the area of Semiconductor R&D we have a requirement for a system that can handle substrates of varying sizes from 0.3x0.3 mm and various irregular shaped pieces through to full wafers which could include wafers ranging in size from 50mm, 100mm, 150mm and 200 mm wafers.
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Currency code: EUR 💰
Total value of the procurement (excluding VAT) (lowest offer): 1699000.00
Total value of the procurement (excluding VAT) (highest offer): 1900000.00
Description
Description of the procurement:
“The Specialty Products and Services Centre (SP&S) at Tyndall National Institute, UCC, carry out analysis on a wide variety of Semiconductor devices, ranging...”
Description of the procurement
The Specialty Products and Services Centre (SP&S) at Tyndall National Institute, UCC, carry out analysis on a wide variety of Semiconductor devices, ranging from traditional Silicon microelectronics and Silicon MEMS to III-V photonic devices. We wish to extend our capability in the area of focussed ion beam (which can encompass Gallium beam/plasma/laser milling or a combination thereof) by purchasing a fully functional load locked system including pumps which will allow us to move our processing to a higher TRL level in terms of substrate size, milling speed and quality of lamella preparation. As much of the work is in the area of Semiconductor R&D we have a requirement for a system that can handle substrates of varying sizes from 0.3x0.3 mm and various irregular shaped pieces through to full wafers which could include wafers ranging in size from 50mm, 100mm, 150mm and 200mm wafers. The tender response must clearly show the costs for all items and any additional options must be clearly identified as such and costed separately.
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Quality criterion (name): Technical merit of offering
Quality criterion (weighting): 40 %
Quality criterion (name): Strategic agreements
Quality criterion (weighting): 10 %
Quality criterion (name): Technical support and maintenance installation and commissioning
Quality criterion (weighting): 15 %
Price (weighting): 35 %
Procedure Administrative information
Previous publication concerning this procedure: 2020/S 177-425298
Award of contract
1️⃣
Contract Number: 1
Title: UCC — High Performance Focussed Ion Beam Milling Capability
Date of conclusion of the contract: 2021-04-30 📅
Information about tenders
Number of tenders received: 4
Number of tenders received by electronic means: 4
Name and address of the contractor
Name: TESCAN-UK Ltd
National registration number: 177010526
Postal address: Unit 2, Wellbrook Court Girton
Postal town: Cambridge
Postal code: CB3 0NA
Country: United Kingdom 🇬🇧
E-mail: info-uk@tescan.com📧
Region: United Kingdom 🏙️
URL: http://tescan.com🌏
The contractor is an SME
Information on value of the contract/lot (excluding VAT)
Currency code: EUR 💰
Lowest offer: 1690000.00
Highest offer: 1900000.00
Complementary information Review body
Postal town: Dublin
Postal code: 7
Source: OJS 2021/S 132-350489 (2021-07-07)