Provision of XeF2 Etch System
UCC is seeking expressions of interest for the provision of plasma etch system which is specific to realising anisotropic etching of silicon/polysiicon/germanium using XeF2 based chemistry.
Deadline
The time limit for receipt of tenders was 2015-12-07.
The procurement was published on 2015-11-26.
Suppliers
The following suppliers are mentioned in award decisions or other procurement documents:
Who?
What?
Procurement history
| Date |
Document |
| 2015-11-26
|
Contract notice
|
| 2016-04-29
|
Contract award notice
|