UCC/2013/23 - Provision of a Laser Welding System
The equipment should be capable of aligning and assembling a number of chip-scale active and passive photonic components in a single photonic package assembly. These chip-scale components would typically consist of laser diodes, semiconductor optical amplifiers (SOAs), photodiodes, microlenses, optical filters, isolators and fibres. The system should be compatible with packaging for single mode optical fibre applications. It
should also be capable of UV cure epoxy dispensing for micro component fixture and compatible with an additional laser welding or soldering installation.
Deadline
The time limit for receipt of tenders was 2013-08-14.
The procurement was published on 2013-07-05.
Who?
What?
Procurement history
| Date |
Document |
| 2013-07-05
|
Contract notice
|