Silicon Etch System
Due to the high rate of utilisation of the present MEMS Silicon etch system at Tyndall, a requirement has been identified to source a second deep silicon etch system for MEMS applications (Microsystems Fabrication) in the CFF. This system must match or enhance the current Silicon Etch capabilities at Tyndall.
The system must be versatile and allow for upgrades as our needs change. In addition, ongoing commitment to support process development projects, as well as prompt field service support must be guaranteed.
To assist potential vendors, Tyndall has drawn up the following process and mechanical specifications for this machine, which are considered as targets to be achieved by the manufacturer. The specifications detailed in this document are for functional deep silicon etch system capable of anisotropic through-wafer etching.
NOTE: To register your interest in this notice and obtain any additional information please visit the eTenders Web Site at
http://www.etenders.gov.ie/Search/Search_Switch.aspx?ID=396432.
The awarding authority has indicated that it will accept electronic responses to this notice via a 'Tender Submission Postbox' facility. Further details of this facility are available at
http://www.etenders.gov.ie/PostBox/Postbox_Explain.aspx?ID=396432.
Suppliers are advised to allow adequate time for uploading documents and to dispatch the electronic response well in advance of the closing time to avoid any last minute problems. The postbox closes precisely at the time stated.
Deadline
The time limit for receipt of tenders was 2012-04-25.
The procurement was published on 2012-03-13.
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Procurement history
| Date |
Document |
| 2012-03-13
|
Contract notice
|