Provision of a wafer bonding system - chemical mechanical planarization (CMP) tool
The Central fabrication facility at Tyndall Institute is involved in the process development and fabrication of nanoscale MOS devices. As part of this development it is necessary to purchase a chemical mechanical planarization (CMP) tool. A CMP tool is used to achieve uniform removal rates on the polishing of semiconductor materials, in single or combination composition, in the manufacture of integrated circuits and semiconductor devices. A CMP tool uses both chemical and mechanical processes to polish a wafer. The mechanical process occurs via the action of particles in slurry reacting with the pad asperities. The chemical process occurs in the action of the slurry on the wafers. The pad and wafer are pressed together and rotated on a platen. The CMP contains a pad conditioning mechanism which restores the pad surface and removes the build-up from the removal material.
The CMP tool will mainly be used for R&D purposes and small scale production and throughput is not a major issue for consideration. Initially it will be used for 100mm wafers but it should be upgradable to 200mm wafers. A small footprint is a distinct advantage. CMP is an essential step in the manufacture of integrated circuits and uniformity and flatness of the wafer surface are key performance considerations for the tool.
Note: to register your interest in this notice and obtain any additional information please visit the eTenders web site at
http://www.etenders.gov.ie/Search/Search_Switch.aspx?ID=438512.
The awarding authority has indicated that it will accept electronic responses to this notice via a 'Tender Submission Postbox' facility. Further details of this facility are available at
http://www.etenders.gov.ie/PostBox/Postbox_Explain.aspx?ID=438512.
Suppliers are advised to allow adequate time for uploading documents and to dispatch the electronic response well in advance of the closing time to avoid any last minute problems. The postbox closes precisely at the time stated.
Deadline
The time limit for receipt of tenders was 2012-07-09.
The procurement was published on 2012-05-29.
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Procurement history
| Date |
Document |
| 2012-05-29
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Contract notice
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