Provision of Cleaner and Bonder System
University College Cork invites tenders for the provision of Cleaner and Bonder system.
We aim to deliver CMOS-compatible substrates fabricated by low temperature direct wafer bonding. Our primary requirement for the new cleaner and bonder system is that it delivers void-free bonded pairs (Silicon-Silicon, Silicon-Germanium) after low temperature direct bonding. The cleaning and bonding operations will be performed on to a variety of substrates such as silicon and germanium, patterned or non-patterned. The bonder system must be designed in such a way that the cleaning, drying and contacting of full wafers are done in a semi automated and integrated mode.
NOTE: To register your interest in this notice and obtain any additional information please visit the eTenders Web Site at
http://www.etenders.gov.ie/Search/Search_Switch.aspx?ID=318452.
The awarding authority has indicated that it will accept electronic responses to this notice via a 'Tender Submission Postbox' facility. Further details of this facility are available at
http://www.etenders.gov.ie/PostBox/Postbox_Explain.aspx?ID=318452.
Suppliers are advised to allow adequate time for uploading documents and to dispatch the electronic response well in advance of the closing time to avoid any last minute problems. The postbox closes precisely at the time stated.
Deadline
The time limit for receipt of tenders was 2011-11-15.
The procurement was published on 2011-10-05.
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What?
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Procurement history
| Date |
Document |
| 2011-10-05
|
Contract notice
|
| 2011-10-10
|
Additional information
|