Recent procurements where the supplier Ev Group Europe & Asia Pacific Gmbh is mentioned
2011-11-18"Wafer Bonder System" provision of cleaner and bonder system (University College Cork (UCC))
The Tyndall National Institute is currently establishing a flexible fabrication facility, โFlexifabโ an essential component of this facility is a capability for bonding III-V and other materials to silicon. In establishing this bonding capability multiple items of equipment will be required, these will all be opened for tender under the umbrella term โWafer Bonding Systemโ. This current call is for the provision of a bonding and cleaning system.
We aim to deliver CMOS-compatible substrates fabricated by โฆ
View the procurement ยป Mentioned suppliers:Ev Group Europe & Asia Pacific Gmbh